The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...

Opening marks a milestone for high-volume manufacturing of 3D advanced packaging technologies. RIO RANCHO, N.M.--(BUSINESS WIRE)--What’s New: Today, Intel celebrated the opening of Fab 9, its ...

Dublin, Jan. 27, 2026 (GLOBE NEWSWIRE) -- The "3D Semiconductor Packaging Market Report 2026" has been added to ResearchAndMarkets.com's offering. This report provides a thorough insight into the ...

Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service... China's ...

With the surging demand for advanced semiconductors powering generative AI and end-user device AI, Samsung Electronics is reportedly set to launch its 3D packaging technology in 2024, entering the ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...