Semiconductor Today

Lumentum, Astera Labs and Corning demo 1060nm VCSEL-based PCIe-over-optics for AI rack-scale connectivity at OCP Global Summit

Lumentum, Astera Labs and Corning demo 1060nm VCSEL-based PCIe-over-optics for AI rack-scale connectivity at OCP Global Summit ...
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Corning Climbs 6% as AI Optical Interconnect Demo Highlights Its Fiber; Lumentum, Coherent and Applied Optoelectronics Rise 4%

A joint AI optical interconnect demo named Lumentum as its author, yet Corning stock is outrunning everyone else in the session, and that inversion tells a story about how the market is repricing the ...

Corning (GLW) To Show High Density Optical Chip Links At ECOC 2026

Qualcomm and Lumentum plan to showcase a high-density die to die optical connectivity solution at ECOC 2026. The joint demo targets AI scale up architectures that require higher bandwidth, lower ...
MarketScreener

Lumentum, Qualcomm, and Corning to Demonstrate High-Density 1060 nm VCSEL Optical D2D Connectivity for AI Scale-Up at ECOC 2026

Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) ...
MarketScreener

Lumentum, Qualcomm Technologies, And Corning Demonstrate High-Density 1060 Nm VCSEL Optical Die-To-Die Connectivity For AI Scale-Up At ECOC 2026

Qualcomm Technologies, Inc. and Corning Incorporated of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstration will ...