Advanced CMOS process technologies enable IC designers to deliver higher performing devices, but also increase the need for extra board-level ESD protection to ensure the reliability of the end ...
Electrostatic discharge (ESD) issues in integrated circuit (IC) chip designs have become more critical at advanced semiconductor process nodes, due to shrinking transistor dimensions and oxide layer ...
Electrostatic discharge (ESD) protection is critical at advanced nodes to safeguard designs against effects intensified by shrinking transistor dimensions and oxide layer thicknesses. On the other ...
A very cost-effective solution for ESD protection in USB 2.0/3.0 applications is to combine an internal ESD protection structure (integrated in the USB transceiver) with a robust, high-current ...
AUSTIN, Texas--(BUSINESS WIRE)--The Silicon Integration Initiative Compact Model Coalition is proud to announce the release of the ASM-ESD diode model, a new electrostatic discharge compact modeling ...
Fig 1. Comparison of a traditional ESD protection design methodology and the PicoGuard XS architecture shows how the latter can provide matched inductance. Fig 2. In a traditional ESD device, the ...
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