Nasdaq

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Yahoo Finance

EnerVenue Announces Plating Equipment and Materials Agreements with Precision Process and Precious Plate

FREMONT, Calif., June 29, 2022 (GLOBE NEWSWIRE) -- EnerVenue, the first company to bring metal-hydrogen batteries capable of 30,000 cycles to the clean energy revolution, today announced it has ...
Nasdaq

ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems

FREMONT, Calif., May 06, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Business Wire

NEXX Systems Announces Electroplating Process & Equipment Development Collaboration for Advanced Semiconductor Packaging

BILLERICA, Mass.--(BUSINESS WIRE)--NEXX Systems today announced a multi-year joint development program with IBM on advanced semiconductor chip packaging and integration. In the program, IBM and NEXX ...
PR Newswire

Commercial Metal Plating Equipment Market to Reach $528.9 million, Globally, by 2032 at 4.3% CAGR: Allied Market Research

Increased demand for metal plating applications in the automotive industry is fueling the market for electroplating, galvanizing, and anodizing equipment. The automotive industry is one of the largest ...
Seeking Alpha

SCHMID GROUP ships first InfinityLine P+ Panel-Level Plating System A Breakthrough in Integrated Plating Technology

FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a leading global provider of equipment and solutions for the electronics industry, today announced the shipment of ...
Business Wire

Tanaka Precious Metals: Electroplating Engineers of Japan Launched Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating ...

TOKYO--(BUSINESS WIRE)--Tanaka Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae) today announced that Electroplating Engineers of Japan, Limited (Head ...
Marine Link

In the Dock with Selective Electroplating

Surface plating is widely used to repair or salvage critical components in the marine industry. As many components need disassembly, the repair process is typically carried out when the ship is in dry ...