Cost-effective burn-in-with-test is essential to produce high reliability components. To ensure uniform burn-in of all components, a test solution must control the temperature, voltage, power, test ...

Burnsville, Minn. — Ironwood Electronics has introduced two high-performance BGA ZIF sockets for 1.0-mm pitch BGA ICs. The SG-BGA-6245 and SG-BGA-6246 sockets are designed for STMicro 35-mm and 27-mm ...

EAGAN, MN – February, 2015 – Ironwood Electronics has recently introduced a new BGA socket designusing high performance elastomer capable of 75GHz, very low inductance and wide temperatureapplications ...

Groomed for the company’s GHz BGA socket family, the HS-SG-6002 heat sink screw supports 31 mm x 31 mm to 42.5 mm x 42.5 mm package sizes and dissipates up to 16W with a fan mounted on top. In ...

It's been discovered that some third-party heat sinks can physically damage Intel's new Skylake CPUs, along with the pins in the accompanying motherboard socket. The problem has prompted at least one ...

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