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MIT's chip stacking breakthrough could cut energy use in power-hungry AI processes

Data doesn’t have to travel as far or waste as much energy when the memory and logic components are closer together.
Electronic Design

Packaging: DRAM Stacking Technology Enables High-Density Modules

Based on chip-scale packaging (CSP), a new lead-free DRAM stacking technology enables the design and manufacture of cost-effective, high-density DRAM modules for large servers, telecom switches, and ...