A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Flat materials that can morph into three-dimensional shapes have potential applications in architecture, medicine, robotics, space travel, and much more. But programming these shape changes requires ...
Industry experts, competitors and even your customers are talking about machine learning and artificial intelligence. As they continue to grow in popularity, more companies than ever before are ...
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